April 2011Logos Solvo is a now a Supporter member of the Open Mobile Alliance (OMA), a worldwide operating Standards Development Organization located at San Diego, United States.
Logos Solvo joins up with industry top names like Microsoft, IBM, Oracle Corporation, Philips, Motorola, Samsung, LG Electronics, Siemens to help make mobile applicative protocols interoperable with existing cellular network technologies worldwide.
As a provider of innovative solutions & applications to the Mobile Telecommunications Industry, Logos Solvo will be able to share its experience and know-how with industry leaders, helping to consolidate standards activity within the mobile data service industry and hereby decreasing operational costs for all involved.
Created in June 2002, the Open Mobile Alliance (OMA) main goal is to regroup all the industry forums addressing mobile application protocols under a single umbrella. OMA is also the focal point for the development of mobile service enabler specifications, which support the creation of interoperable end-to-end mobile services.
Throughout the years, OMA has pioneered significant consolidation of mobile service enabler organisations with the integration of the WAP Forum, Location Interoperability Forum (LIF), SyncML Initiative, MMS-IOP (Multimedia Messaging Interoperability Process), Wireless Village, Mobile Gaming Interoperability Forum (MGIF), and the Mobile Wireless Internet Forum (MWIF) into OMA.
Significant new work in OMA is leading to the development of mobile service enablers in areas such as Device Management, Push-to-talk Over Cellular, Mobile Broadcast and more.
142 international companies are currently OMA members. This include traditional wireless industry players such as equipment and mobile systems manufacturers (Sony Ericsson, Siemens, Nokia, Philips, Motorola, Samsung, LG) and mobile operators (Vodafone, Orange, T-Mobile, LG Telecom, Deutsche Telekom), but also software vendors (Microsoft, Sun Microsystems, IBM, Oracle Corporation, Symbian, Celltick, Expway, InnoPath ).
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